Precision Ceramics
Grinding and polishing routes for hard, brittle components. The application covers ceramic parts, suitable abrasive tools and the need to match material, geometry and finish requirements.
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Explore published application scopes. Machine and tooling suitability depend on the material, geometry and process requirements.
Semiconductor Materials
Explore wafer/substrate processing with specialised cutting, backgrinding and polishing tools. Individual operations require material-specific tooling; this does not imply every machine on this site is a wafer grinder.
Explore application →Hydraulic Components
Grinding applications for hydraulic parts include sealing and precision mating surfaces. Double-disc wheel selection can be relevant to valve plates and related flat components, with separate source documentation for cylindrical operations.
Explore application →Automotive Parts
The application spans several automotive grinding operations. For this product range, discuss the particular flat part, material, tolerance and production requirement before choosing a double-disc configuration.
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