Planetary Carriers

Workpiece carriers for precision grinding and polishing of wafers, crystal substrates and optical components. Blue-steel, stainless-steel and epoxy-board constructions suit different processing conditions.

Why this configuration

Laser-cut and CNC-machined carrier options
Stainless steel is described for acid/alkali process environments
Epoxy-board carriers offer a different contact interface, with limited thin-sheet strength noted

Technical specifications

Construction	Selection considerations
Blue steel	Heat-treated carrier construction; confirm thickness and geometry
Stainless steel	Process chemistry and corrosion resistance
Epoxy board	Contact conditions, strength and service life
Drawing inputs	Workpiece pockets, carrier thickness and gear geometry

The source includes unusual warpage/speed claims without complete test conditions. Those figures are not promoted as acceptance specifications.

Applications & workpiece selection

Silicon and SiC substrates
Sapphire windows and piezoelectric crystals
Quartz and optical glass

Specify material, part dimensions, stock removal, surface targets and production quantity so the configuration can be checked for the intended process.

Confirm the details before selection

Workpiece & process

Provide a drawing, material grade, hardness where applicable, incoming condition and required geometry. Published results must be read with their original test conditions.

Machine & tooling

Confirm the model, mounting dimensions, interfaces, abrasive or carrier specification, coolant and required documents. Request a dimensioned drawing for the configuration being quoted.