More Superhard at CIOE 2026

Overview

The grinding and polishing team attended CIOE in Shenzhen on 9–11 September 2026. The manufacturer describes discussions around optics, wafer processing, diamond compounds and polishing pads, together with process selection for hard and brittle materials.

Reading context

The original publication provides the full process discussion and supporting context. Use it alongside the relevant product specification, and confirm the current configuration and workpiece requirements before placing an order.

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This page is a concise source-backed overview. The linked publication retains its original detailed discussion.